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专利名称：Self-Aligning Structures and Method for
Integrated Chips
发明人：Randolph Cruz申请号：US13251846申请日：20111003
公开号：US20120032317A1公开日：20120209
专利附图：
摘要：A lead frame having a die thereon connects a conductive area on the die to alead frame contact using a conductive clip that includes a structural portion that isreceived with a recess-like “tub” formed in the lead frame contact. The end of the clip
received in the tub is held in place during subsequent handling by a solder paste deposituntil the clip and leadframe undergo solder reflow to effect a reliable electrical
connection. The effective surface area between one side of the clip and the other side ofthe clip within the tub is different so that the surface tension of the liquefied solderformed during the solder reflow step will “draw” the clip into a preferred alignmentagainst a “stop” surface.
申请人：Randolph Cruz
地址：Melbourne FL US
国籍：US
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