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专利名称：Method for fabricating an embedded
pattern using a transfer-based imprinting
发明人：Jun-Hyuk Choi,Eung-Sug Lee,Ji-Hye Lee,Jun-ho Jeong,Joo-Yun Jung,Dae-GuenChoi,Cheol-Hyeon Kim
申请号：US14194084申请日：20140228公开号：US09791601B2公开日：20171017
专利附图：
摘要：In a method for fabricating an embedded pattern using a transfer-based
imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photocurable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formedon an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-filmlayer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiatedto cure the adhesive layer. The stamp is removed.
申请人：KOREA INSTITUTE OF MACHINERY & MATERIALS
地址：Daejeon KR
国籍：KR
代理机构：Hauptman Ham, LLP
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