专利内容由知识产权出版社提供
专利名称：Hollow microspheres with wall through-openings
发明人：Anderson, Paul Richard,Wuttke, Gilbert
Henry
申请号：EP84113631申请日：19841112公开号：EP0150288A3公开日：19860416
专利附图：
摘要：Hollow microspheres or shells having wall through-openings, and methods formanufacture thereof, which find application as microcarriers for anchorage-dependent
cell cultivation and as fillers for thermal insulation purposes. Hollow glass or polymericshells having removal-susceptible wall zones carried by a wall matrix are chemicallytreated to remove the susceptible zones and thereby leave the matrix wall with through-openings. The shells may be vacuum coated to obtain a discrete reflective surface layerwhich seals an evacuated interior, or, in the case of glass, the shells may be vacuumsintered to close the through-openings, and then coated to obtain the reflective surfacelayer.
申请人：KMS Fusion, Inc.
代理人：Wehnert, Werner, Dipl.-Ing. Patentanwälte Hauck, Graalfs, Wehnert, Döring,Siemons
更多信息请下载全文后查看