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Methods of making microelectronic assemblies havin

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专利名称:Methods of making microelectronic

assemblies having conductive elastomericposts

发明人:Joseph Fjelstad申请号:US10079743申请日:20020220公开号:US067099B2公开日:20040323

专利附图:

摘要:A method of manufacturing a microelectronic assembly includes providing afirst microelectronic element having a first surface and a plurality of terminals exposed at

the first surface, providing a second microelectronic element having a top surface and aplurality of contacts exposed at the top surface, forming a plurality of conductiveelastomeric posts which connect each of the contacts to one of the terminals, andinjecting a compliant material between the first surface of the first microelectronicelement and the top surface of the second microelectronic element to form a compliantlayer.

申请人:TESSERA, INC.

代理机构:Lerner, David, Littenberg, Krumholz & Mentlik, LLP

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